JACoW logo

Journals of Accelerator Conferences Website (JACoW)

JACoW is a publisher in Geneva, Switzerland that publishes the proceedings of accelerator conferences held around the world by an international collaboration of editors.


BiBTeX citation export for MOPMB009: Plasma Electrolytic Polishing Technology Progress Development for Nb and Cu Substrates Preparation

@inproceedings{chyhyrynets:srf2023-mopmb009,
  author       = {E. Chyhyrynets and O. Azzolini and R. Caforio and D. Fonnesu and D. Ford and G. Keppel and G. Marconato and C. Pira and A. Salmaso and F. Stivanello},
% author       = {E. Chyhyrynets and O. Azzolini and R. Caforio and D. Fonnesu and D. Ford and G. Keppel and others},
% author       = {E. Chyhyrynets and others},
  title        = {{Plasma Electrolytic Polishing Technology Progress Development for Nb and Cu Substrates Preparation}},
% booktitle    = {Proc. SRF'23},
  booktitle    = {Proc. 21th Int. Conf. RF Supercond. (SRF'23)},
  pages        = {75--79},
  eid          = {MOPMB009},
  language     = {english},
  keywords     = {cavity, cathode, plasma, experiment, SRF},
  venue        = {Grand Rapids, MI, USA},
  series       = {International Conference on RF Superconductivity},
  number       = {21},
  publisher    = {JACoW Publishing, Geneva, Switzerland},
  month        = {09},
  year         = {2023},
  issn         = {2673-5504},
  isbn         = {978-3-95450-234-9},
  doi          = {10.18429/JACoW-SRF2023-MOPMB009},
  url          = {https://jacow.org/srf2023/papers/mopmb009.pdf},
  abstract     = {{Superconducting radio frequency (SRF) cavity performance is highly dependent on surface preparation. Conventionally, electropolishing (EP) is used to achieve a clean surface and low roughness for both Nb and Cu substrates, but it requires harsh and corrosive solutions like concentrated acids. Plasma Electrolytic Polishing (PEP) is a promising alternative that uses only diluted salt solutions and has several advantages over EP. PEP can replace intermediate steps like mechanical or chemical polishing, thanks to its superior removal rate of up to 2-8 um/min of Nb and 3-30 um/min of Cu. It achieves Ra roughness of 100 nm for both substrates and has a higher smoothing effect than EP. PEP is also suitable for normal conducting cavities and other accelerator components, including couplers. We demonstrate the effectiveness of PEP on SRF substrates and analyse substrate defect evaluation. We demonstrate the application of PEP onto SRF substrates and analyse the substrate’s defect evaluation. The ongoing work includes Nb bulk and Nb on Cu QPR treatments and RF tests in collaboration with HZB.}},
}