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RIS citation export for SUSPB005: Plasma Electrolytic Polishing Technology Progress Development for Nb and Cu Substrates Preparation

TY  - CONF
AU  - Chyhyrynets, E.
AU  - Azzolini, O.
AU  - Caforio, R.
AU  - Fonnesu, D.
AU  - Ford, D.
AU  - Keppel, G.
AU  - Marconato, G.
AU  - Pira, C.
AU  - Salmaso, A.
AU  - Stivanello, F.
ED  - Saito, Kenji
ED  - Xu, Ting
ED  - Sakamoto, Naruhiko
ED  - Schaa, Volker R.W.
ED  - Thomas, Paul W.
TI  - Plasma Electrolytic Polishing Technology Progress Development for Nb and Cu Substrates Preparation
J2  - Proc. of SRF2023, Grand Rapids, MI, USA, 25-30 June 2023
CY  - Grand Rapids, MI, USA
T2  - International Conference on RF Superconductivity
T3  - 21
LA  - english
AB  - Superconducting radio frequency (SRF) cavity performance is highly dependent on surface preparation. Conventionally, electropolishing (EP) is used to achieve a clean surface and low roughness for both Nb and Cu substrates, but it requires harsh and corrosive solutions like concentrated acids. Plasma Electrolytic Polishing (PEP) is a promising alternative that uses only diluted salt solutions and has several advantages over EP. PEP can replace intermediate steps like mechanical or chemical polishing, thanks to its superior removal rate of up to 2-8 um/min of Nb and 3-30 um/min of Cu. It achieves Ra roughness of 100 nm for both substrates and has a higher smoothing effect than EP. PEP is also suitable for normal conducting cavities and other accelerator components, including couplers. We demonstrate the effectiveness of PEP on SRF substrates and analyse substrate defect evaluation. We demonstrate the application of PEP onto SRF substrates and analyse the substrate’s defect evaluation. The ongoing work includes Nb bulk and Nb on Cu QPR treatments and RF tests in collaboration with HZB.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 75
EP  - 79
DA  - 2023/09
PY  - 2023
SN  - 2673-5504
SN  - 978-3-95450-234-9
DO  - doi:10.18429/JACoW-SRF2023-MOPMB009
UR  - https://jacow.org/srf2023/papers/mopmb009.pdf
ER  -