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RIS citation export for SUSPB006: Analysis of Semiconductor Components as Temperature Sensors for Cryogenic Investigation of SRF Materials

TY  - CONF
AU  - Cierpka, A.
AU  - Keckert, S.
AU  - Knobloch, J.
AU  - Kramer, F.
AU  - Kugeler, O.
ED  - Saito, Kenji
ED  - Xu, Ting
ED  - Sakamoto, Naruhiko
ED  - Schaa, Volker R.W.
ED  - Thomas, Paul W.
TI  - Analysis of Semiconductor Components as Temperature Sensors for Cryogenic Investigation of SRF Materials
J2  - Proc. of SRF2023, Grand Rapids, MI, USA, 25-30 June 2023
CY  - Grand Rapids, MI, USA
T2  - International Conference on RF Superconductivity
T3  - 21
LA  - english
AB  - Temperature mapping systems have been used for many years to detect local heating in an SRF cavity surface or materials sample. They require a large number of temperature sensors. Most often, low-cost Allen-Bradley resistors are used for this purpose. Since they have poor sensitivity and reproducibility above 4 K, sensor alternatives that combine the precision of Cernox sensors with the low-cost of Allen-Bradley resistors would be highly desirable. In this work various semiconductor components that exhibit a temperature dependent electrical response, such as diodes and LEDs were analyzed with respect to sensitivity, reproducibility and response speed in a temperature range between 6.5 K and 22 K. In this range, many diodes and LEDs were found to be more sensitive than Cernox sensors. However, in some components the response time was slow - possibly due to poor thermal contact.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 80
EP  - 83
DA  - 2023/09
PY  - 2023
SN  - 2673-5504
SN  - 978-3-95450-234-9
DO  - doi:10.18429/JACoW-SRF2023-MOPMB010
UR  - https://jacow.org/srf2023/papers/mopmb010.pdf
ER  -