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RIS citation export for WEPWB070: Test Shipment of the PIP-II 650 MHz Transport Frame Between FNAL to STFC-UKRI

TY  - CONF
AU  - Holzbauer, J.P.
AU  - Chandrasekaran, S.K.
AU  - Grimm, C.J.
AU  - Kane, M.T.W.
AU  - Ozelis, J.P.
AU  - Thiede, R.
AU  - Wixson, A.D.
ED  - Saito, Kenji
ED  - Xu, Ting
ED  - Sakamoto, Naruhiko
ED  - Schaa, Volker R.W.
ED  - Thomas, Paul W.
TI  - Test Shipment of the PIP-II 650 MHz Transport Frame Between FNAL to STFC-UKRI
J2  - Proc. of SRF2023, Grand Rapids, MI, USA, 25-30 June 2023
CY  - Grand Rapids, MI, USA
T2  - International Conference on RF Superconductivity
T3  - 21
LA  - english
AB  - The PIP-II Project will receive fully assembled cryomodules from CEA and STFC-UKRI as in-kind contributions. Damage to these cryomodules during transport is understood to be a significant risk to the project, so an extensive testing and validation program is in process to mitigate this risk. The centerpiece of this effort is the eventual shipment from FNAL to STFC-UKRI and back of a prototype HB650 cryomodule with cold testing before and after shipment to verify no functionality changes from shipment. Most recently, a test shipment to the UK and back using a cryomodule analog was completed using realistic logistics, handling, instrumentation, and planning. The process of executing this test shipment, lessons learned, and plan moving forward will be presented here.
PB  - JACoW Publishing
CP  - Geneva, Switzerland
SP  - 750
EP  - 754
KW  - cryomodule
KW  - ISOL
KW  - linac
KW  - SRF
KW  - acceleration
DA  - 2023/09
PY  - 2023
SN  - 2673-5504
SN  - 978-3-95450-234-9
DO  - doi:10.18429/JACoW-SRF2023-WEPWB070
UR  - https://jacow.org/srf2023/papers/wepwb070.pdf
ER  -