Author: Coladonato, G.
Paper Title Page
WEPWB073 Prototype HB650 Cryomodule Heat Loads Simulations 755
 
  • G. Coladonato
    University of Illinois at Chicago, Chicago, USA
  • D. Passarelli, V. Roger
    Fermilab, Batavia, Illinois, USA
  
  Funding: This manuscript has been authored by Fermi Research Alliance, LLC, under Contract No. DE-AC02-07CH11359 with the U.S. Department of Energy, Office of Science, Office of High Energy Physics.
During the design stages of the PIP-II cryomodules, many analytical calculations and FEA have been performed on simpler geometry in order to estimate the heat loads and also to optimize the design. To better analyze the cryomodule cold tests, simulations have been performed with MATLAB to determine the temperature of the main components during cool down and to determine the heat loads of the cryomodule. These simulations have been applied to the High Beta 650 MHz prototype cryomodule design and compared to the cold tests performed on it. 		 
poster icon Poster WEPWB073 [1.981 MB]  
DOI • reference for this paper ※ doi:10.18429/JACoW-SRF2023-WEPWB073  
About • Received ※ 19 June 2023 — Revised ※ 25 June 2023 — Accepted ※ 27 June 2023 — Issue date ※ 28 June 2023
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