SRF2023 - List of Authors (Kane, M.T.W.)

Paper	Title	Page
WEPWB070	Test Shipment of the PIP-II 650 MHz Transport Frame Between FNAL to STFC-UKRI	750
	J.P. Holzbauer, S.K. Chandrasekaran, C.J. Grimm, J.P. Ozelis, R. Thiede, A.D. Wixson Fermilab, Batavia, Illinois, USA M.T.W. Kane STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
	Funding: Work supported by Fermi Research Alliance, LLC under Contract No. DEAC02- 07CH11359 with the United States Department of Energy The PIP-II Project will receive fully assembled cryomodules from CEA and STFC-UKRI as in-kind contributions. Damage to these cryomodules during transport is understood to be a significant risk to the project, so an extensive testing and validation program is in process to mitigate this risk. The centerpiece of this effort is the eventual shipment from FNAL to STFC-UKRI and back of a prototype HB650 cryomodule with cold testing before and after shipment to verify no functionality changes from shipment. Most recently, a test shipment to the UK and back using a cryomodule analog was completed using realistic logistics, handling, instrumentation, and planning. The process of executing this test shipment, lessons learned, and plan moving forward will be presented here.
DOI •	reference for this paper ※ doi:10.18429/JACoW-SRF2023-WEPWB070
About •	Received ※ 18 June 2023 — Revised ※ 27 June 2023 — Accepted ※ 28 June 2023 — Issue date ※ 17 July 2023
Cite •	reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)

Paper

Title

Page

Test Shipment of the PIP-II 650 MHz Transport Frame Between FNAL to STFC-UKRI

750

J.P. Holzbauer, S.K. Chandrasekaran, C.J. Grimm, J.P. Ozelis, R. Thiede, A.D. Wixson
Fermilab, Batavia, Illinois, USA
M.T.W. Kane
STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom

Funding: Work supported by Fermi Research Alliance, LLC under Contract No. DEAC02- 07CH11359 with the United States Department of Energy
The PIP-II Project will receive fully assembled cryomodules from CEA and STFC-UKRI as in-kind contributions. Damage to these cryomodules during transport is understood to be a significant risk to the project, so an extensive testing and validation program is in process to mitigate this risk. The centerpiece of this effort is the eventual shipment from FNAL to STFC-UKRI and back of a prototype HB650 cryomodule with cold testing before and after shipment to verify no functionality changes from shipment. Most recently, a test shipment to the UK and back using a cryomodule analog was completed using realistic logistics, handling, instrumentation, and planning. The process of executing this test shipment, lessons learned, and plan moving forward will be presented here.

DOI •

reference for this paper ※ doi:10.18429/JACoW-SRF2023-WEPWB070

About •

Received ※ 18 June 2023 — Revised ※ 27 June 2023 — Accepted ※ 28 June 2023 — Issue date ※ 17 July 2023

Cite •

reference for this paper using ※ BibTeX, ※ LaTeX, ※ Text/Word, ※ RIS, ※ EndNote (xml)