Author: Wixson, A.D.
Paper Title Page
TUPTB047 The Evaluation of Mechanical Properties of LB650 Cavities 536
 
  • G. Wu, S.D. Adams, D.J. Bice, S.K. Chandrasekaran, I.V. Gonin, C.J. Grimm, J.P. Holzbauer, T.N. Khabiboulline, C.S. Narug, J.P. Ozelis, H. Park, G.V. Romanov, R. Thiede, R. Treece, A.D. Wixson
    Fermilab, Batavia, Illinois, USA
  • K.E. McGee
    FRIB, East Lansing, Michigan, USA
 
  Funding: This manuscript has been authored by Fermi Research Alliance, LLC, under Contract No. DE-AC02-07CH11359 with the U.S. Department of Energy, Office of Science, Office of High Energy Physics.
The 650 MHz cavities have a stronger requirement of niobium mechanical properties because of the geometric shape of the cavity due to reduced beta. The mechanical property of the niobium half-cell was measured following various heat treatments. The 5-cell cavities were tested in a controlled drop test fashion and the real-world road test. The result showed that the 900C heat treatment was compatible with cavity handling and transportation during production. The test provides the bases of the transportation specification and shipping container design guidelines.
 
DOI • reference for this paper ※ doi:10.18429/JACoW-SRF2023-TUPTB047  
About • Received ※ 19 June 2023 — Revised ※ 24 June 2023 — Accepted ※ 26 June 2023 — Issue date ※ 14 July 2023
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WEPWB070 Test Shipment of the PIP-II 650 MHz Transport Frame Between FNAL to STFC-UKRI 750
 
  • J.P. Holzbauer, S.K. Chandrasekaran, C.J. Grimm, J.P. Ozelis, R. Thiede, A.D. Wixson
    Fermilab, Batavia, Illinois, USA
  • M.T.W. Kane
    STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
 
  Funding: Work supported by Fermi Research Alliance, LLC under Contract No. DEAC02- 07CH11359 with the United States Department of Energy
The PIP-II Project will receive fully assembled cryomodules from CEA and STFC-UKRI as in-kind contributions. Damage to these cryomodules during transport is understood to be a significant risk to the project, so an extensive testing and validation program is in process to mitigate this risk. The centerpiece of this effort is the eventual shipment from FNAL to STFC-UKRI and back of a prototype HB650 cryomodule with cold testing before and after shipment to verify no functionality changes from shipment. Most recently, a test shipment to the UK and back using a cryomodule analog was completed using realistic logistics, handling, instrumentation, and planning. The process of executing this test shipment, lessons learned, and plan moving forward will be presented here.
 
DOI • reference for this paper ※ doi:10.18429/JACoW-SRF2023-WEPWB070  
About • Received ※ 18 June 2023 — Revised ※ 27 June 2023 — Accepted ※ 28 June 2023 — Issue date ※ 17 July 2023
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